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Rigid-Flex & Flex Manufacturing Capabilities:

Layer Construction:

Single-Sided
Flex Rigid
Multilayer
Double-Sided
Dual Access
Unsupported Leads

Trace/Space:

1/2 oz. copper - .003/.003 +/- .0005
1 oz. copper - .006/.006 +/- .0015
2 oz. copper - .012/.012 +/- .003
Etch capabilities up to 14 oz.

Radii:

Outside minimum sharp 90
Inside standard .030
Inside absolute minimum .010

Plating:

Electroless Copper
Electrolytic Copper
Hard & Soft Gold
Tin Immersion
Electrolytic Tin Lead (Solder)
Hot Air Level
Entek Organic Coating

Material:

Polyimide
Kapton
Teflon/Duroid
FR4
Getek
Thermount
Epoxy & Acrylic Adhesive Systems (UL approved)
Adhesiveless Copper-Clad Laminates (IPC)

Meet CTE & Thermal Requirements by Incorporating:

CIC Cores (Copper-Invar-Copper)
CMC Cores (Copper-Moly-Copper)
Copper or Aluminum Cores
Bonded Heatsinks

Soldermask:

Dry Film Mask (3 or 4 mils)
Conformask
LPI (Liquid Photo Imageable) Various Colors

Kapton/Standard Thickness for Base, Cover film & Stiffeners:

.5 mil
1.0 mil
2.0 mil
3.0 mil
4.0 mil
5.0 mil
6.0 mil

Electrical Testing:

Net List Test
Flying Probe Test
Through Hole Test
Dual Access Test

Product Built to ANSI/IPC & Military Standards

Additional Capabilities:

FR4 & Kapton stiffeners
Design & documentation
Microwave applications
Folding & PSA lamination of 3-dimensional stiffeners
Custom machining such as headers & brackets
Creasing
Hardware installation
Impedance cables/assemblies

 

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KADFLX Inc. - 74 Northeastern Blvd. Bldg.13/14 - Nashua, NH 03062 - (603) 881-3000
Copyright 2004 - 2011 - KADFLX, Inc. - All rights reserved / Produced by
i4Market, LLC


Printed Circuit Board Manufacturing - Flexible Printed Circuits - Multiple Layer Riged Flex