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Printed Circuit Board Manufacturing & Engineering Capabilities:


Standard PCB Thickness:

.014 D/S 4 layers
.018 D/S 6 layers
.062 D/S 12 layers
.093 D/S 20 layers
.125 D/S 30 layers
.250 - Maximum

Max. Panel Size:

24 x 36

Line & Space:

0.004/0.004 IL
0.004/0.004 OL

Min. Hole Size (finished):

Single & D/S = .008 Buried/Blind Via
Multilayer = .004 Microvia

Via Hole Drill Diameter:

0.008 (proto)
0.0135 (prod.)

Min. Via Pad Diameter:

0.020 (proto)
0.025 (prod.)

SMT Pitch:

0.010

Min. Blind & Buried Vias

0.010 (prototype)
0.0118 (production)

BGA, mBGA Pitch:

0.8mm (prototype)
1.0mm (production)

Material:

High Tg Epoxy Materials
Cyanate Ester
Teflon
Rogers 4003
Copper-Invar-Copper
Getek
Kevlar
Copper-Moly-Copper
FR4
Polyimide
Nelco 13 & N6000
BT
Thermount (non-woven Kevlar)

Soldermask:

Dry Film Mask (3 or 4 mils)
Enthone Liquid Photo Imageable (LPI) Various Colors
Conformask

Surface Finishes:

HASL
SMOBC
Gold over Cu
Gold over Palladium
Selective Gold
Hard & Soft Gold
Electroless Nickel
Immersion Gold
Immersion Tin
Electroless Copper
OSP (Organic Solderability Preservative)
Gold over Ni over Cu

Electrical Test:

Voltage: 10-250 volts
Isolation: 10 Kilohms to 500 Megohms
Continuity: 1 to 1,000 ohms
Impedance: Single ended and differential
Net list testing: Single & Dual Access Fixtures Flying Probe
 

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KADFLX Inc. - 74 Northeastern Blvd. Bldg.13/14 - Nashua, NH 03062 - (603) 881-3000
Copyright 2004 - 2011 - KADFLX, Inc. - All rights reserved / Produced by
i4Market, LLC


Printed Circuit Board Manufacturing - Flexible Printed Circuits - Multiple Layer Riged Flex